LMS-1-P7622-16URUG
piece
1
COB | SMD | |
Chip | Big chip | Small chip,not enough space for small size chip encapsulated on the welding basement |
Bonding wire | Pure golden wire | copper wire,alloy wire for better, aluminum for worse |
Bracket | Immersion gold process on welding basement | Copper bracket, steel bracket, immersion silver process on welding basement |
COB | SMD | |
Chip | Big chip | Small chip,not enough space for small size chip encapsulated on the welding basement |
Bonding wire | Pure golden wire | copper wire,alloy wire for better, aluminum for worse |
Bracket | Immersion gold process on welding basement | Copper bracket, steel bracket, immersion silver process on welding basement |
LMS-1-P7622-16URUG | ||
NO. | Item | Parameter |
1 | Pitch | 7.62mm |
2 | Density | 17222 Dot/M2 |
3 | Color | 1R1G |
4 | Unit panel /display size | 244mm*128mm/244mm*122mm |
5 | Unit panel resolution | 16*32 |
6 | Unit panel Weight | 113g |
7 | Scan Mode | 1/16 |
8 | Production methods | COB |
9 | Chip Brand | R:Epistar G:Silan |
10 | PCB specification | Immersion Gold finishing,Line Copper thick 40um,Hole copper thick 20um,Ni:120u″,Au:1u″ |
11 | COB protection Glue | Epoxy resin,TG 135 degree |
12 | Driving Mode | constant current drive |
13 | constant-current source | TW MBI5124 |
14 | Best Viewing distance | 12m |
15 | Horizontal view angle | 180° |
LMS-1-P7622-16URUG | ||
NO. | Item | Parameter |
1 | Pitch | 7.62mm |
2 | Density | 17222 Dot/M2 |
3 | Color | 1R1G |
4 | Unit panel /display size | 244mm*128mm/244mm*122mm |
5 | Unit panel resolution | 16*32 |
6 | Unit panel Weight | 113g |
7 | Scan Mode | 1/16 |
8 | Production methods | COB |
9 | Chip Brand | R:Epistar G:Silan |
10 | PCB specification | Immersion Gold finishing,Line Copper thick 40um,Hole copper thick 20um,Ni:120u″,Au:1u″ |
11 | COB protection Glue | Epoxy resin,TG 135 degree |
12 | Driving Mode | constant current drive |
13 | constant-current source | TW MBI5124 |
14 | Best Viewing distance | 12m |
15 | Horizontal view angle | 180° |