16x32 ultra-thin flexible indoor LED display module
Product Description
1. Wider viewing angle: COB lighting angle is about 175 degree. SMD lighting angle is about 120 degree.
Ours: COB SMD
2. Ultra-thin:
2.1 Our LED chips soldered directly on the high-quality PCB and save more space especially for double-sided LED screen.
2.2 Good heat dissipation & less lighting attenuation: because COB dispensing chip is directly in the PCB, the area of heat dissipation is more wider than SMD technology, and it’s lighting attenuation is more better. The area of heat dissipation is the bottom neck to SMD, for its chip fixed on the bottom of the PPA bracket
2.3 Light Weight and even with outside aluminum or plastic frames, its thickness can be still 2-5cm only. Easy transportation and save freight cost.
(The left one is our COB item)
3. Flexible: flexibility is one of the excellent characteristics of COB modules. So COB modules can be shaped canopy screen, arc shaped screen, circle shaped screen and wave shaped screen. It is the ideal choose for bars and nightclubs. COB screen is with seamless splice, simple structure, and lower price which less than FPCB and traditional LED shaped screen. For example, P4 RGB modules can be made into circle shaped screen with min diameter 50CM. Because of the excellent performance, COB module was widely used in airport,station,mall and so on.
LIGHTKEY COB module
4. Better LED chips and other raw materials: key for long-term application with stability and reliability.
COB (Chip on Board), Encapsulating RGB chip on the PCB, It’s a totally new encapsulation technical which is different from DIP and SMD
5. Durability: can used in different harsh environments
5.1 Anti-collision&shock COB is not easily damaged in contrast to SMD
5.2 Anti-water&Damp COB can be wiped clean with a wet cloth,in contrast to SMD
5.3 Anti-dust&Oxidation COB is dust-proof,in contrast to SMD
Ours: COB SMD
2. Ultra-thin:
2.1 Our LED chips soldered directly on the high-quality PCB and save more space especially for double-sided LED screen.
2.2 Good heat dissipation & less lighting attenuation: because COB dispensing chip is directly in the PCB, the area of heat dissipation is more wider than SMD technology, and it’s lighting attenuation is more better. The area of heat dissipation is the bottom neck to SMD, for its chip fixed on the bottom of the PPA bracket
2.3 Light Weight and even with outside aluminum or plastic frames, its thickness can be still 2-5cm only. Easy transportation and save freight cost.
(The left one is our COB item)
3. Flexible: flexibility is one of the excellent characteristics of COB modules. So COB modules can be shaped canopy screen, arc shaped screen, circle shaped screen and wave shaped screen. It is the ideal choose for bars and nightclubs. COB screen is with seamless splice, simple structure, and lower price which less than FPCB and traditional LED shaped screen. For example, P4 RGB modules can be made into circle shaped screen with min diameter 50CM. Because of the excellent performance, COB module was widely used in airport,station,mall and so on.
LIGHTKEY COB module
4. Better LED chips and other raw materials: key for long-term application with stability and reliability.
COB (Chip on Board), Encapsulating RGB chip on the PCB, It’s a totally new encapsulation technical which is different from DIP and SMD
COB | SMD | |
Chip | Big chip | Small chip,not enough space for small size chip encapsulated on the welding basement |
Bonding wire | Pure golden wire | copper wire,alloy wire for better, aluminum for worse |
Bracket | Immersion gold process on welding basement | Copper bracket, steel bracket, immersion silver process on welding basement |
5.1 Anti-collision&shock COB is not easily damaged in contrast to SMD
5.2 Anti-water&Damp COB can be wiped clean with a wet cloth,in contrast to SMD
5.3 Anti-dust&Oxidation COB is dust-proof,in contrast to SMD
Technical Data Sheet
LMS-1-P7622-16URUG | ||
NO. | Item | Parameter |
1 | Pitch | 7.62mm |
2 | Density | 17222 Dot/M2 |
3 | Color | 1R1G |
4 | Unit panel /display size | 244mm*128mm/244mm*122mm |
5 | Unit panel resolution | 16*32 |
6 | Unit panel Weight | 113g |
7 | Scan Mode | 1/16 |
8 | Production methods | COB |
9 | Chip Brand | R:Epistar G:Silan |
10 | PCB specification | Immersion Gold finishing,Line Copper thick 40um,Hole copper thick 20um,Ni:120u″,Au:1u″ |
11 | COB protection Glue | Epoxy resin,TG 135 degree |
12 | Driving Mode | constant current drive |
13 | constant-current source | TW MBI5124 |
14 | Best Viewing distance | 12m |
15 | Horizontal view angle | 180° |