5050 RGB SMD LED with PLCC6

·SMT Reflow Soldering Instructions

Notes:

1. We recommend the reflow temperature 245±5℃.The maximum soldering temperature should be limited to 260℃ for 10s (max).

2. Don’t cause stress to the epoxy resin while it is exposed to high temperature.

3. Number of reflow process shall be 2 times or less.

·Handling Precautions

Epoxy resin is hard & brittle and silicone is softer & flexible. Although its characteristic significantly thermal stress, it is more susceptible to damage by external mechanical force.

As a result, special handling precautions need to be observed during assembly using silicone encapsulated

LED products. Failure to comply might lead to damage and premature failure of the LED.

1. Handle the component along the side surface by using forceps or appropriate tools (fig.1); do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry(fig.2&3).

2. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent  air leaks. The inner diameter of the nozzle should be as large as possible. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.

3.  Prevent stack together assembled PCBs containing.

PH<7. LEDs. Impact may scratch the silicone lens or damage the internal circuitry(fig.4).

4. 4. Non-suitable to operate in acidic environment, (Fig.5)

5. LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material.

·ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrostatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.

·Storage

In order to prevent the absorption of moisture, it is recommended to solder LITEKEY LEDs as soon as possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

1. Temperature:5℃-30℃(41℉-86℉) Humidity: RH 60% Max.

2. After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:

A. Completed within 168 hours.              

B.  Stored at less than 30% RH.

3. Devices required baking before mounting, if:(2)a or (2)b is not met.

4. If baking is required, devices must be baked under below condition:48 hour at 60℃±3℃.

·Other

1. Above specification may be changed without notice. LITEKEY will reserve authority on material change for above specification.

2. When using this product, please abserve the absolute maximum ratings and the instructions for using outlined in these specification sheets. LITEKEY assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.

3. These specification sheets include materials protected under copyright of LITEKEY COMPANY LIMITED. Please don’t reproduce cause by anyone to reproduce them without LITEKEY’s consent.