0603 white SMD LED

0603 Surface Mount LEDs (LLS0603CW1)

·Package Dimensions of white chip LED 0603                     

NOTES：

1.All dimensions are in millimeter[unit];

2.Tolerance is±0.1mm(0.004”) unless other specified;

3.Specifications are subject to change without notice.

·Features

1.6*0.8*0.60mm

Mono-color type

Soldering methods :All SMT assembly methods

Comply ROHS standard

·Description

This white SMD LEDs 0603 are made with InGaN on sapphire

Light Emitting Diode.

Application

LCD backlight

Illuminations

Part No.	Emitted Color	Lens Color	Chip Material
LLS0603CW1(0.60)	Cool White	Yellow Diffused	InGaN

Absolute Maximum Ratings(Ta=25℃)

Item	Symbol	Maximum	Unit
Power Dissipation	PD	135	mW
Continuous Forward Current	IFmax	30	mA
Peak Forward Current(1/10 Duty Cycle 0.1ms Pulse Width)	IFP	140	mA
Reverse Voltage	VR	5	V
Operating TemperatureRange	Topr	-40 to+85	℃
Storage TemperatureRange	Tstg	-40 to+85	℃
Lead Solder Temperature	Tsol	260ºC for 3 seconds

Electrical/Optical Characteristics(Ta=25℃)

Item	Symbol	Condition	Min.	Typ.	Max	Unit
Forward Voltage	VF	IF=20mA	--	3.0	3.6	V
Luminous Intensity	IV	IF=20mA	400	--	600	mcd
Color Temperature	Tc	IF=20mA	--	7500	12000	K
Viewing Angle	2θ1/2	IF=20mA	---	120	---	Deg
Reverse Current	IR	VR =5V	---	---	10	uA

·Typical Electro-Optical Characteristics Curves

Reliability Test Items and Conditions of 0603 white ChipLED

NO.	Item	Test Condition	Test Hr/cycle/time	Sample Q’ty	Ac/Re
1	Reflow	TEMP:260±5℃; Min.5Sec	6 min	22pcs	0/1
2	Temperature Cycle	H:+100℃ 15mins To(5mins) L:-40℃ 15mins	20 cycles	22pcs	0/1
3	Thermal Shock	H:+100℃ 15mins To(5mins) L:-40℃ 15mins	100 cycles	22pcs	0/1
4	High Temperature Storage	TEMP: 85℃	1000hrs	22pcs	0/1
5	Low Temperature Storage	TEMP:-40℃	1000hrs	22pcs	0/1
6	DC Operating Life	IF=20MA	1000hrs	22pcs	0/1
7	High Humidity	85%R.H.	1000hrs	22pcs	0/1

SMT Reflow Soldering Instructions of SMD LED 0603

Notes:

1. We recommend the reflow temperature 245±5℃.The maximum soldering temperature should be limited to 260℃ for 10s (max).

2. Don’t cause stress to the epoxy resin while it is exposed to high temperature.

3. Number of reflow process shall be 2 times or less.

The production of chip LED 0603: