1206 Red SMD LED

1206 Red Surface Mount LEDs (LLS1206UR1)

Package Dimensions of red chip LED 1206                     

NOTES：

1.All dimensions are in millimeter[unit];

2.Tolerance is±0.1mm(0.004”) unless other specified;

3.Specifications are subject to change without notice.

Features

3.2*1.6*0.90mm

Mono-color type

Soldering methods :All SMT assembly methods

Comply ROHS standard

Description

The Yellow Green source color devices are made with AlGaInP on sapphire  Light Emitting Diode.

Application of 1206 red chip LED

Optical indicator

Indicator and backlighting in telephone and fax

Flat backlight for LCD, switch and symbol

Light pipe application

General use

Part No.	Emitted  Color	Len’s Color	Chip Material
LLS1206UR1(0.80)	Red	Water   Clear	AlGaInP

Absolute Maximum Ratings(Ta=25℃)

Item	Symbol	Maximum	Unit
Power Dissipation	PD	75	mW
Continuous Forward Current	IFmax	30	mA
Peak Forward Current(1/10   Duty Cycle 0.1ms Pulse Width)	IFP	80	mA
Reverse Voltage	VR	5	V
Operating TemperatureRange	Topr	-40 to+85	℃
Storage TemperatureRange	Tstg	-40 to+85	℃
Lead Solder Temperature	Tsol	260ºC for 3 seconds

Electrical/Optical Characteristics(Ta=25℃)

Item	Symbol	Condition	Min.	Typ.	Max	Unit
Forward Voltage	VF	IF=20mA	1.9	---	2.2	V
Luminous Intensity	IV	IF=20mA	70	100	150	mcd
Wavelength	l	IF=20mA	618	620	625	nm
Viewing Angle	2θ1/2	IF=20mA	---	120	---	Deg
Reverse Current	IR	VR   =5V	---	---	10	uA

·

Reliability Test Items and Conditions of 1206 red ChipLED

NO.	Item	Test Condition	Test Hr/cycle/time	Sample Q’ty	Ac/Re
1	Reflow	TEMP:260±5℃; Min.5Sec	6 min	22pcs	0/1
2	Temperature Cycle	H:+100℃ 15mins To(5mins) L:-40℃ 15mins	20 cycles	22pcs	0/1
3	Thermal Shock	H:+100℃ 15mins To(5mins) L:-40℃ 15mins	100 cycles	22pcs	0/1
4	High Temperature Storage	TEMP: 85℃	1000hrs	22pcs	0/1
5	Low Temperature Storage	TEMP:-40℃	1000hrs	22pcs	0/1
6	DC Operating Life	IF=20MA	1000hrs	22pcs	0/1
7	High Humidity	85%R.H.	1000hrs	22pcs	0/1

SMT Reflow Soldering Instructions of SMD LED 1206

Notes:

1. We recommend the reflow temperature 245±5℃.The maximum soldering temperature should be limited to 260℃ for 10s (max).

2. Don’t cause stress to the epoxy resin while it is exposed to high temperature.

3. Number of reflow process shall be 2 times or less.

The production of chip LED 1206: